We offer consulting and turn-key services in the semiconductor packaging industry, especially on wafer back-end, wafer-level/advanced packaging such as 2.5D / 3D, and semiconductor package assembly. Our comprehensive background and contractual agreements enable us to work with foundries, Outsourced Assembly and Test (OSAT) providers, Equipment Manufacturers, Materials Suppliers, Component Suppliers, and Integrated (IDM) or Fabless Chip Design Companies.

Coming Soon! XFactor Semiconductor

Expert Advice for Investors

Expert calls to gain insights and comprehend publicly available information.

Custom Research

We provide research on market position and industry trends to help with equity research towards assessing  investment potential in a company.

Productization

We take your concept to prototype and manufacturing while you focus on developing the concept and designing and marketing your product to meet customer needs.

Technology Development

We help you form a roadmap for semiconductor packaging and define test vehicles to demonstrate your process capability.

Guiding Businesses Towards Profitable Growth

At XFactor Semiconductor, we offer expert management consulting services to help businesses achieve sustained success.

Our team of experienced consultants will work closely with you to develop and implement strategies that drive growth and maximize profitability.

Meet the Team

Experienced and dedicated professionals ready to tackle any business challenge.

John Smith

Founder and CEO

Jane Doe

Head Consultant

Mark Johnson

Marketing Manager