We offer consulting and turn-key services in the semiconductor packaging industry, especially on wafer back-end, wafer-level/advanced packaging such as 2.5D / 3D, and semiconductor package assembly. Our comprehensive background and contractual agreements enable us to work with foundries, Outsourced Assembly and Test (OSAT) providers, Equipment Manufacturers, Materials Suppliers, Component Suppliers, and Integrated (IDM) or Fabless Chip Design Companies.

Coming Soon! XFactor Semiconductor

Expert Advice for Investors

Expert calls to gain insights and comprehend publicly available information.

Custom Research

We provide research on market position and industry trends to help with equity research towards assessing  investment potential in a company.

Productization

We take your concept to prototype and manufacturing while you focus on developing the concept and designing and marketing your product to meet customer needs.

Technology Development

We help you form a roadmap for semiconductor packaging and define test vehicles to demonstrate your process capability.

Guiding Investors Towards Returns Through Expert Advice and Custom Research

We work with the investors to evaluate investment opportunities and options to determine a course of action. We also work with entrepreneurs to evaluate growth opportunities, ecosystem, SWOT analysis, to enable growth and attract investment.

We share our background in semiconductor technology and continuous research to make decision making a competitive advantage for our clients.

Technology Development

We enable you stay focused on manufacturing while we research the market and survey the customers to help you form a technology roadmap. We further help define test vehicles to develop the manufacturing process and to demonstrate qualification readiness to your customers.

Productization

We enable our clients to stay focused on product development and working with and serving their customers by taking their product concept to prototyping volume manufacturing.